R&D Management – Product Design How much does design internalization matter in the face of technological change? Woo-Yong Park ; Young K. Ro ; Ji-Hwan Lee Organizing to Achieve Modular Architecture Across Different Products Tucker James Marion ; Marc H. Meyer Information Flow Through Stages of Complex Engineering Design Projects: A Dynamic Network Analysis Approach Pedro Parraguez ; Steven D. Eppinger ; Anja M. Maier Examining the Roles of Product Complexity and Manager Behavior on Product DesignDecisions: An Agent-Based Study Using NK Simulation Ilaria Giannoccaro ; Anand Nair An Extended Fuzzy-AHP Approach for the Evaluation of Green Product Designs Hing Kai Chan ; Xiaojun Wang ; Gareth Reginald Terence White ; Nick Yip Green Product Design With Engineering Tradeoffs Under Technology Efficient Frontiers: Analytical Results and Empirical Tests Chialin Chen ; Jun Zhang Improving System Maturity Assessments by Incorporating a Design Structure Matrix Zuhal Tompkins ; Michael Grenn ; Blake Roberts Design Structure Matrix Extensions and Innovations: A Survey and New Opportunities Tyson R. Browning Measuring Modularity: Engineering and Management Effects of Different Approaches Anna Cabigiosu ; Arnaldo Camuffo Updating a Modular Product: How to Set Time to Market and Component Quality Lifang Wu ; Renato De Matta ; Timothy J. Lowe Share this:LinkedInTwitterFacebookEmailWhatsAppLike this:Like Loading... Subscribe to Newsletter Search TEMS – 5 Focus Areas Moving Product/Services from Idea to Market Identifying and Implementing Successful Projects, and Systems Integrating Technology for Capability and Productivity Developing from Engineer to Leader Balancing the Norms of Society, Government, and Regulators Message from IEEE TEMS President https://youtu.be/ZiTu9395KS8Attend upcoming Conference Join IEEE TEMS Follow us on TwitterMy TweetsCall for papers call-for-papers • Conferences Call for Papers: lEEE Technology and Engineering Management Society Conference: Asia-Pacific (TEMSCON – ASPAC 2021) April 6, 2021 call-for-papers Special Issue: Reimaging emerging technologies in the new normal: Forecasting growth trajectory, risk and resistance towards a friction-free diffusion in varied industry verticals April 5, 2021 call-for-papers CFP: Application of Big Data Analysis for Trend Spotting Related to the Development and Use of Human Capital April 5, 2021 Popular Topicsand CIMS Conferences Digitization Engineering exclude Featured FEB-2020 first impression frontpage IEEE IEEE 2030 IEEE 2030 Initiative IEEE TEMS IEEE TEMS Administrative Committee IEEE TEMS ELECTION 2018 IEEE TEMS Elections IEEE TEMS Elections 2017 IEEE TEMS LEADER IEEE TEMS VISION include Industry Forum Leader Leader-FEB-2020 Leader-SEP-2020 LeaderAug2019 Management President President's Message Presidents Column Resume building Society Talent Management technology TEMS TEMSCON-2017 TEMSCON 2019 TEMSCON2019 TEMS Conferences tems india TEMS President TMTL Top Downloads youtube yt
call-for-papers • Conferences Call for Papers: lEEE Technology and Engineering Management Society Conference: Asia-Pacific (TEMSCON – ASPAC 2021) April 6, 2021
call-for-papers Special Issue: Reimaging emerging technologies in the new normal: Forecasting growth trajectory, risk and resistance towards a friction-free diffusion in varied industry verticals April 5, 2021
call-for-papers CFP: Application of Big Data Analysis for Trend Spotting Related to the Development and Use of Human Capital April 5, 2021
