IEEE Transactions on Engineering Management

IEEE Transactions On Engineering Management

ABOUT IEEE TEM


Mission

IEEE Transactions on Engineering Management (IEEE-TEM) is a journal of the Technology and Engineering Management Society of IEEE, published quarterly since 1954. It is dedicated to the publication of peer-reviewed original contributions, by researchers and practitioners, regarding the theory and practice of engineering, technology, and innovation management.

IEEE-TEM’s intended audience includes IEEE members and the worldwide audience of researchers, practitioners, educators, and graduate students engaged in the profession of engineering, technology, and innovation management.

The purpose of the Transactions is multifold:

To assist in the establishment and recognition of the engineering management discipline, including management of technology, supply chains, and innovation.

To become the premier knowledge forum for the researchers and practitioners of technology, engineering, supply chains, and innovation management in academic institutions, industrial organizations, government agencies, and other settings.

To establish the guidelines and identify the future directions of critical issues in engineering, technology, supply chains, and innovation management.

For more information on the journal, please read the editorial from Tsan-Ming (Jason) Choi, Ph.D., Editor-In-Chief: Editorial: IEEE Transactions on Engineering Management 2025.

Submission Guidelines

The paper should be prepared following the standard styling requirements of IEEE Transactions. During the review process, single column is preferred. If necessary, standard IEEE Transactions double column formatting is acceptable (page limit becomes 15 pages). IEEE-TEM adopts the standard double blind review process. Please remove any hints which may reveal author identity from the mainbody (e.g., funding information). For the initial submission, the mainbody of all types of papers should be within 38 pages, single column (1 inch margins, font size 12, double line spacing). Put extra materials to an online appendix as supplementary materials. Please make sure the paper is written in well-polished English and the similarity index with prior studies is not high (e.g., less than 20%).

As a unique feature of IEEE-TEM, please add a paragraph called “Managerial Relevance Statement” (placed under the list of keywords and above Section I) to explain the usefulness and importance of the paper for engineering management practices/policies. 

Submission Types

IEEE-TEM is a research journal and publishes high-quality original research and review papers in the areas indicated above. Full-length original research papers must contribute significantly to the literature with important managerial insights based on rigorous analyses. Research papers which focus on applications may be publishable as short papers called “notes”. In addition to original research articles and review papers, we also invite leading scholars in the field to contribute to TEM Forum – Perspectives. Interested scholars who would like to contribute to TEM Forum should first talk to the editor-in-chief prior to their submission for the suitability and guidance.


CONTACT INFORMATION

Editor-In-Chief

Tsan-Ming Choi (Jason), Ph.D.
Chair in Operations and Supply Chain Management
Director of Centre for Supply Chain Research
Management School, University of Liverpool
Liverpool, L69 7ZH,
United Kingdom
Phone: 44 (0)151 794 0434
Email: t.m.choi@liverpool.ac.uk
Web :
https://www.liverpool.ac.uk/people/jason-choi

Editorial Office:
Priyanka Roy
Publications Peer Review Support Specialist
IEEE Publishing Operations
Email:  roy.p@ieee.org

TEMS – 5 Focus Areas

Moving Product/Services from Idea to Market

Identifying and Implementing Successful Projects, and Systems

Integrating Technology for Capability and Productivity

Developing from Engineer to Leader

Balancing the Norms of Society, Government, and Regulators

Attend upcoming Conference

IEEE International Conference on Smart Mobility (IEEESM'23)

Join IEEE TEMS