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June 1, 2023

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IEEE Technology and Engineering Management Society
  • Home
  • Networking
    • Conferences
      • IEEE TEMS LAIF 2023
      • 2023-InnoConf
      • TEMS-ICTE
      • IEEE ICE Conference 2023
      • ICTMOD
    • Technical Activities
      • Carbon Neutrality
      • International Protocols for AI Security
      • IEEE TEMS TC on Blockchain and Distributed Ledger Technologies
      • Design and Engineering Processes
      • Smart Medical Digitalization
      • IoT & AI Initiative
        • Latin America IoT & AI Challenge
        • Africa IoT & AI Challenge
        • Arab IoT & AI Challenge
        • IEEE GCAIoT
    • Industry & IEEE Society Engagement Committee
    • Connect with community
  • Publications
    • IEEE TEMS Leadership BRIEFS
      • Current Issue
      • Past Issues
      • Editorial Board
      • How to Submit
    • IEEE Transactions on Engineering Management
      • CURRENT ISSUE
      • PREVIOUS ISSUE
      • SUBSCRIBE
      • Call for papers
      • TOP DOWNLOADS
      • Technology Management
      • Engineering Management
      • Emerging Technologies
      • About
        • EDITORIAL REVIEW BOARD
      • AUTHOR/REVIEWER
        • GUIDELINES FOR AUTHORS
        • GUIDELINES AFTER ACCEPTANCE
        • GUIDELINES FOR REVIEWERS
    • IEEE Engineering Management Review
      • About
      • Editorial Board
      • Top Downloads
      • Current Issue
      • Previous Issues
      • Editor’s Pick
      • Information for Authors
    • Virtual Special Issue – Case Collections
      • Innovation: Entrepreneurship
      • Innovation: Strategy
      • Innovation: Managing Technological Innovations
      • R&D Management – Strategies
      • R&D Management – Product Design
      • R&D Management – New Product Development
      • Project Management – Recent Advances
      • Project Management – Classics
      • Project Management – Masters
  • Education
    • IEEE TEMS TV & Radio
    • Project Marie
  • Membership
  • About Us
    • Mission
    • Executive Leadership Team
    • Contact Us
  • Become a Member
IEEE Technology and Engineering Management Society
  • Home
  • Networking
    • Conferences
      • IEEE TEMS LAIF 2023
      • 2023-InnoConf
      • TEMS-ICTE
      • IEEE ICE Conference 2023
      • ICTMOD
    • Technical Activities
      • Carbon Neutrality
      • International Protocols for AI Security
      • IEEE TEMS TC on Blockchain and Distributed Ledger Technologies
      • Design and Engineering Processes
      • Smart Medical Digitalization
      • IoT & AI Initiative
        • Latin America IoT & AI Challenge
        • Africa IoT & AI Challenge
        • Arab IoT & AI Challenge
        • IEEE GCAIoT
    • Industry & IEEE Society Engagement Committee
    • Connect with community
  • Publications
    • IEEE TEMS Leadership BRIEFS
      • Current Issue
      • Past Issues
      • Editorial Board
      • How to Submit
    • IEEE Transactions on Engineering Management
      • CURRENT ISSUE
      • PREVIOUS ISSUE
      • SUBSCRIBE
      • Call for papers
      • TOP DOWNLOADS
      • Technology Management
      • Engineering Management
      • Emerging Technologies
      • About
        • EDITORIAL REVIEW BOARD
      • AUTHOR/REVIEWER
        • GUIDELINES FOR AUTHORS
        • GUIDELINES AFTER ACCEPTANCE
        • GUIDELINES FOR REVIEWERS
    • IEEE Engineering Management Review
      • About
      • Editorial Board
      • Top Downloads
      • Current Issue
      • Previous Issues
      • Editor’s Pick
      • Information for Authors
    • Virtual Special Issue – Case Collections
      • Innovation: Entrepreneurship
      • Innovation: Strategy
      • Innovation: Managing Technological Innovations
      • R&D Management – Strategies
      • R&D Management – Product Design
      • R&D Management – New Product Development
      • Project Management – Recent Advances
      • Project Management – Classics
      • Project Management – Masters
  • Education
    • IEEE TEMS TV & Radio
    • Project Marie
  • Membership
  • About Us
    • Mission
    • Executive Leadership Team
    • Contact Us
  • Become a Member
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