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October 2, 2022

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IEEE Technology and Engineering Management Society
  • Home
  • IEEE TEMS TV
  • Publications
    • IEEE TEMS Leadership BRIEFS
    • IEEE Transactions on Engineering Management
      • CURRENT ISSUE
      • PREVIOUS ISSUE
      • SUBSCRIBE
      • Call for papers
      • TOP DOWNLOADS
      • Technology Management
      • Engineering Management
      • Emerging Technologies
      • About
        • EDITORIAL REVIEW BOARD
      • AUTHOR/REVIEWER
        • GUIDELINES FOR AUTHORS
        • GUIDELINES AFTER ACCEPTANCE
        • GUIDELINES FOR REVIEWERS
    • IEEE Engineering Management Review
      • Current Issue
      • Previous Issues
    • IEEE TEMS Leader
    • Virtual Special Issue – Case Collections
      • Innovation: Entrepreneurship
      • Innovation: Strategy
      • Innovation: Managing Technological Innovations
      • R&D Management – Strategies
      • R&D Management – Product Design
      • R&D Management – New Product Development
      • Project Management – Recent Advances
      • Project Management – Classics
      • Project Management – Masters
    • GENERAL INFORMATION
  • Members Engagements
    • Benefits
      • Team Playbooks
    • TEMS Chapters
      • TEMS Regional Chapters
        • Austria
        • INDIA
      • Chapter activities
      • CHAPTERS NEWSLETTERS
      • Opening a New Chapter/ Joint Chapter
      • Opening a Student Branch Chapter
      • Resources for Chapter Chairs
        • Chapter Chairs webinars
        • HANDLING THE TRANSITION TO SOCIETY
  • Conferences
    • IEEE E-TEMS 2023
    • Conference Roadmap
    • Steps for organising IEEE TEMS Conferences
    • TEMSCON
      • 2021
        • TEMSCON – Asia Pacific
        • TEMSCON – Europe
      • TEMSCON 2020
      • TEMSCON 2019
    • ISIE
      • ISIE 2019
      • ISIE 2020
    • ICTE
      • ICTE 2021
      • ICTE 2020
    • Industry Forum
      • India
        • 2019
        • 2018
    • Young Professionals
      • Y-TEMS
      • IEEE TEMS Young Professionals
  • Technical Committees
    • Carbon Neutrality
    • International Protocols for AI Security
    • IEEE TEMS TC on Blockchain and Distributed Ledger Technologies
    • Technology for Social Good
    • Equity for Minorities in Tech
    • Design and Engineering Processes
    • Smart Medical Digitalization
  • About Us
    • TEMS Vision and Mission
    • Board of Governors
    • Ad-Hoc Committees
    • Elections
    • Information Technology
  • Join Us
IEEE Technology and Engineering Management Society
  • Home
  • IEEE TEMS TV
  • Publications
    • IEEE TEMS Leadership BRIEFS
    • IEEE Transactions on Engineering Management
      • CURRENT ISSUE
      • PREVIOUS ISSUE
      • SUBSCRIBE
      • Call for papers
      • TOP DOWNLOADS
      • Technology Management
      • Engineering Management
      • Emerging Technologies
      • About
        • EDITORIAL REVIEW BOARD
      • AUTHOR/REVIEWER
        • GUIDELINES FOR AUTHORS
        • GUIDELINES AFTER ACCEPTANCE
        • GUIDELINES FOR REVIEWERS
    • IEEE Engineering Management Review
      • Current Issue
      • Previous Issues
    • IEEE TEMS Leader
    • Virtual Special Issue – Case Collections
      • Innovation: Entrepreneurship
      • Innovation: Strategy
      • Innovation: Managing Technological Innovations
      • R&D Management – Strategies
      • R&D Management – Product Design
      • R&D Management – New Product Development
      • Project Management – Recent Advances
      • Project Management – Classics
      • Project Management – Masters
    • GENERAL INFORMATION
  • Members Engagements
    • Benefits
      • Team Playbooks
    • TEMS Chapters
      • TEMS Regional Chapters
        • Austria
        • INDIA
      • Chapter activities
      • CHAPTERS NEWSLETTERS
      • Opening a New Chapter/ Joint Chapter
      • Opening a Student Branch Chapter
      • Resources for Chapter Chairs
        • Chapter Chairs webinars
        • HANDLING THE TRANSITION TO SOCIETY
  • Conferences
    • IEEE E-TEMS 2023
    • Conference Roadmap
    • Steps for organising IEEE TEMS Conferences
    • TEMSCON
      • 2021
        • TEMSCON – Asia Pacific
        • TEMSCON – Europe
      • TEMSCON 2020
      • TEMSCON 2019
    • ISIE
      • ISIE 2019
      • ISIE 2020
    • ICTE
      • ICTE 2021
      • ICTE 2020
    • Industry Forum
      • India
        • 2019
        • 2018
    • Young Professionals
      • Y-TEMS
      • IEEE TEMS Young Professionals
  • Technical Committees
    • Carbon Neutrality
    • International Protocols for AI Security
    • IEEE TEMS TC on Blockchain and Distributed Ledger Technologies
    • Technology for Social Good
    • Equity for Minorities in Tech
    • Design and Engineering Processes
    • Smart Medical Digitalization
  • About Us
    • TEMS Vision and Mission
    • Board of Governors
    • Ad-Hoc Committees
    • Elections
    • Information Technology
  • Join Us
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